Pm2AgSn is an intermetallic compound combining palladium, silver, and tin, belonging to the family of precious-metal-based alloys used primarily in electronics and precision applications. This material is employed in solder formulations, electrical contacts, and hybrid integrated circuits where reliable performance at elevated temperatures and superior corrosion resistance are critical. Its silver and palladium constituents make it particularly valuable in applications demanding low electrical resistance and long-term stability, though cost considerations typically limit its use to high-reliability sectors rather than commodity applications.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 64.77 | GPa | — | ||
Poisson's Ratio(ν) | 0.3500 | - | — | ||
Shear Modulus(G) | 22.84 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 7.986 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Seebeck Coefficient(S) | -40.00 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.5581 | eV/atom | — |