O7 Al4 Cu2

semiconductor

· O7 Al4 Cu2

O7 Al4 Cu2 is an intermetallic compound composed primarily of aluminum and copper with oxygen incorporation, representing a phase in the Al-Cu system with potential ceramic or complex oxide character. This material family is primarily of research interest for advanced structural and functional applications, as intermetallics in the Al-Cu system are generally studied for high-temperature strength, wear resistance, and electronic properties rather than widespread industrial production. Engineers would consider Al-Cu intermetallics when designing lightweight, high-stiffness composites or coatings, though commercial adoption remains limited compared to conventional aluminum alloys.

research compound—phase mappinghigh-temperature structural applicationswear-resistant coatingscomposite reinforcementelectronic materials development

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.08650	eV	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Formation Energy(ΔHf)	-2.246	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

O7 Al4 Cu2

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control