Ni3Sn is an intermetallic compound in the nickel-tin system, forming a brittle metallic phase that appears in solder joints, coating systems, and high-temperature applications where nickel and tin interact. It is encountered primarily as a reaction product in electronic assembly (particularly in tin-based solder interfaces with nickel plating) and in some specialized aerospace and wear-resistant coatings, where its hardness and thermal stability are valued despite limited ductility. Engineers typically manage rather than deliberately specify Ni3Sn, controlling its formation and thickness in solder interconnects to optimize joint reliability, though research continues into intermetallic strengthening in nickel-tin composites for elevated-temperature structural applications.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K)2 entries | 164.3 | GPa | — | ||
| ↳ | 163.0 | GPa | — | ||
Poisson's Ratio(ν) | 0.3000 | - | — | ||
Shear Modulus(G)2 entries | 65.58 | GPa | — | ||
| ↳ | 75.64 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 9.395 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Seebeck Coefficient(S) | -29.52 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.00610 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.1589 | eV/atom | — |