Ni2 Cu1 Sn1

semiconductor
· Ni2 Cu1 Sn1

Ni₂Cu₁Sn₁ is an intermetallic compound combining nickel, copper, and tin in a defined stoichiometric ratio, classified as a semiconductor material. This ternary alloy belongs to the family of metallic semiconductors and intermetallics, which are of interest in thermoelectric applications, contact materials, and electronic packaging due to their ability to combine metallic conductivity with semiconducting electronic behavior. While primarily a research and development material rather than a commodity product, ternary Ni-Cu-Sn compounds are investigated for solder alternatives, thermal interface materials, and electronic device contacts where the intermetallic structure can provide improved reliability and reduced environmental toxicity compared to lead-based predecessors.

Lead-free solder alternativesThermoelectric devicesElectronic packaging and interconnectsContact materialsMaterials research and developmentIntermetallic research compounds

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65
Units:
siimperial
PropertyValueUnitConditionsSource
Bulk Modulus(K)
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Pa——
Shear Modulus(G)
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Pa——
Verified Unverified Low confidence (<80%) Link to source
PropertyValueUnitConditionsSource
Band Gap(Eg)
—
eV——
Verified Unverified Low confidence (<80%) Link to source
PropertyValueUnitConditionsSource
Formation Energy(ΔHf)
—
eV/atom——
Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.