MgCuSn is a ternary intermetallic compound combining magnesium, copper, and tin—a member of the lightweight magnesium alloy family with potential for enhanced mechanical properties through intermetallic strengthening. This material is primarily of research interest rather than established production use, explored for applications where the combination of low density and intermetallic phase stability could provide strength and stiffness advantages over conventional Mg alloys. The ternary composition suggests potential use in aerospace, automotive, or portable electronics where weight reduction and structural rigidity are competing demands, though commercial adoption remains limited pending demonstration of reliable processing routes and long-term performance validation.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K)3 entries | 63.15 | GPa | — | ||
| ↳ | 63.15 | GPa | — | ||
| ↳ | 64.13 | GPa | — | ||
Elastic Compliance Tensor(Sij) | Matrix (redacted) | 1/GPa | — | ||
Elastic Anisotropy(AU) | 0.1462 | - | — | ||
Elastic Stiffness Tensor(Cij) | Matrix (redacted) | Pa | — | ||
Poisson's Ratio(ν)2 entries | 0.2961 | - | — | ||
| ↳ | 0.2800 | - | — | ||
Shear Modulus(G)3 entries | 29.81 | GPa | — | ||
| ↳ | 29.81 | GPa | — | ||
| ↳ | 33.56 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 5.219 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg)2 entries | 0.000 | eV | — | ||
| ↳ | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Seebeck Coefficient(S) | 6.500 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.2509 | eV/atom | — | ||
Formation Energy(ΔHf) | 0.04071 | eV/atom | — |