InPbAu is a ternary metal alloy combining indium, lead, and gold, primarily investigated for specialized electronic and thermal management applications. This alloy system bridges semiconducting and metallic properties, making it relevant for applications requiring controlled electrical conductivity and thermal transport in constrained geometries. The addition of gold to indium-lead systems enhances corrosion resistance and solder joint reliability, positioning it as a candidate material for high-reliability microelectronic interconnects and specialized bonding applications where conventional lead-containing solders face regulatory or performance limitations.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 50.36 | GPa | — | ||
Poisson's Ratio(ν) | 0.4900 | - | — | ||
Shear Modulus(G) | 1.230 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 10.59 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.1082 | eV/atom | — |