InAu is an intermetallic compound formed from indium and gold, belonging to the precious metal alloy family. It is primarily investigated in microelectronics and materials research for its potential in semiconductor bonding, contact metallurgy, and high-reliability interconnection systems where the combination of indium's softness and gold's stability offers advantages in thermal and electrical performance. This material remains largely in the research and development phase rather than widespread production use, with interest driven by demands for improved bump bonding in flip-chip assemblies and hybrid integrated circuits where conventional solders face thermal cycling challenges.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 11.97 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.06170 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.1200 | eV/atom | — |