InAg

metal
· JVASP-36294· InAg

InAg is a binary intermetallic or solid-solution alloy combining indium and silver, typically used in electronics and optoelectronics where joint strength, thermal conductivity, and electrical performance are critical. This material family is valued in die-attach adhesives, hybrid integrated circuits, and specialty solder applications where conventional lead-free solders or pure metals do not meet thermal cycling or reliability demands. InAg systems offer an alternative to gold-based or tin-based interconnects in high-reliability aerospace and semiconductor packaging, though material selection depends on specific thermal, mechanical, and cost constraints.

die-attach adhesivessemiconductor packaginghybrid integrated circuitsthermal interface materialsaerospace electronicsoptoelectronic device assembly

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65
PropertyValueUnitConditionsSource
Density(ρ)
kg/m³
Verified Unverified Low confidence (<80%) Link to source
PropertyValueUnitConditionsSource
Band Gap(Eg)
eV
Magnetic Moment(μB)
µB
Verified Unverified Low confidence (<80%) Link to source
PropertyValueUnitConditionsSource
Energy Above Hull(ΔEhull)
eV/atom
Formation Energy(ΔHf)
eV/atom
Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.