In3SnAu12

metal

· JVASP-140436· In3SnAu12

In3SnAu12 is an intermetallic compound composed of indium, tin, and gold, belonging to the family of precious metal alloys used primarily in microelectronics and joining applications. This material is primarily encountered in lead-free solder formulations and flip-chip bonding systems, where it offers improved thermal stability and wettability compared to conventional tin-based solders. The inclusion of gold enhances reliability in high-reliability applications such as aerospace and medical devices, though it remains a research and specialized-use compound rather than a commodity material.

lead-free solderflip-chip interconnectsmicroelectronic bondinghigh-reliability electronicsaerospace/medical packaging

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Density(ρ)	15.30	kg/m³	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.000	eV	—
Magnetic Moment(μB)	0.000	µB	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Energy Above Hull(ΔEhull)	0.000	eV/atom	—
Formation Energy(ΔHf)	-0.1076	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

In3SnAu12

Physical Properties

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control