In3SnAu12

metal
· JVASP-140436· In3SnAu12

In3SnAu12 is an intermetallic compound composed of indium, tin, and gold, belonging to the family of precious metal alloys used primarily in microelectronics and joining applications. This material is primarily encountered in lead-free solder formulations and flip-chip bonding systems, where it offers improved thermal stability and wettability compared to conventional tin-based solders. The inclusion of gold enhances reliability in high-reliability applications such as aerospace and medical devices, though it remains a research and specialized-use compound rather than a commodity material.

lead-free solderflip-chip interconnectsmicroelectronic bondinghigh-reliability electronicsaerospace/medical packaging

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65
PropertyValueUnitConditionsSource
Density(ρ)
kg/m³
Verified Unverified Low confidence (<80%) Link to source
PropertyValueUnitConditionsSource
Band Gap(Eg)
eV
Magnetic Moment(μB)
µB
Verified Unverified Low confidence (<80%) Link to source
PropertyValueUnitConditionsSource
Energy Above Hull(ΔEhull)
eV/atom
Formation Energy(ΔHf)
eV/atom
Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.