In3Sn

ceramic

· JVASP-101573· In3Sn

In₃Sn is an intermetallic compound composed of indium and tin, belonging to the class of metallic ceramics or intermetallics rather than traditional ceramics. This material is primarily of research and developmental interest, studied for its potential in electronic packaging, solder applications, and advanced interconnect systems where its phase stability and melting characteristics may offer advantages over conventional lead-free solder compositions. In₃Sn is notable in the context of sustainable electronics manufacturing, as it represents alternatives to legacy solder systems, though it remains less widely deployed in production than binary tin-based solders.

electronic solder and interconnectslead-free solder developmentmicroelectronics packagingresearch and experimental materialsphase-change thermal management candidatesmetallurgical and materials research

Compliance & Regulations

?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Density(ρ)	6.928	kg/m³	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.000	eV	—
Magnetic Moment(μB)	0.000	µB	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Energy Above Hull(ΔEhull)	0.01280	eV/atom	—
Formation Energy(ΔHf)	0.00889	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

In3Sn

Physical Properties

Electrical Properties

Other Properties

Regulatory Screening

Environmental