HoInCu is a ternary intermetallic compound combining holmium, indium, and copper, representing a specialized research alloy rather than a common commercial material. While specific industrial adoption is limited, such rare-earth-containing intermetallics are studied for potential applications in high-performance electronic devices, magnetic systems, and specialized structural applications where the unique electronic or magnetic properties of holmium combined with the metallic bonding of indium and copper may offer advantages over binary alternatives.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 9.135 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.4384 | eV/atom | — |