HoCuSn is a ternary intermetallic alloy combining holmium, copper, and tin, belonging to the rare-earth metal alloy family. This material represents an experimental composition of scientific interest rather than a widely commercialized engineering alloy; such rare-earth copper-tin systems are typically investigated for potential applications in high-performance electronic devices, magnetic applications, or specialized structural components where the unique properties of holmium can be leveraged. Engineers would consider this material primarily in research and development contexts where conventional alloys are insufficient, particularly in applications requiring thermal management combined with specific electromagnetic or mechanical properties.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 82.20 | GPa | — | ||
Poisson's Ratio(ν) | 0.2300 | - | — | ||
Shear Modulus(G) | 53.46 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 8.997 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Seebeck Coefficient(S) | -27.26 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.6187 | eV/atom | — |