Ho3CuSiS7 is an experimental ternary intermetallic compound containing holmium, copper, and silicon with sulfur, belonging to the rare-earth metal sulfide family. This is a research-phase material with limited industrial production; compounds in this class are primarily investigated for their unique electronic and magnetic properties rather than structural applications. Potential applications focus on specialized solid-state physics research, including magnetic refrigeration materials, thermoelectric devices, or magnetocaloric effect studies, though practical engineering adoption remains undeveloped.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 5.667 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 1.918 | eV | — | ||
Dielectric Constant (Relative Permittivity)(εr) | 17.01 | - | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Piezoelectric Modulus(eij) | 0.1532 | C/m² | — | ||
Seebeck Coefficient(S) | -209.8 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -1.656 | eV/atom | — |