HfCu3 is an intermetallic compound combining hafnium and copper in a 1:3 stoichiometric ratio, belonging to the family of refractory metal intermetallics. This material is primarily of research and developmental interest rather than established industrial production, investigated for potential applications in high-temperature structural applications and electronic devices where the combination of hafnium's refractory properties and copper's thermal/electrical conductivity may offer performance advantages over conventional alloys.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 10.79 | kg/m³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | DFT · OptB88vdW | ||
Magnetic Moment(μB) | 0.000 | µB | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf) | -0.1178 | eV/atom | DFT · OptB88vdW |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data