Fe1Cu2Sn1 is an intermetallic compound combining iron, copper, and tin in a fixed stoichiometric ratio, classified as a semiconductor material. This ternary system belongs to the family of transition metal-based intermetallics and is primarily of research interest rather than established in high-volume industrial production. The material's potential lies in applications requiring controlled electronic properties and thermal stability, though its practical adoption depends on developing cost-effective synthesis routes and demonstrating performance advantages over conventional binary copper-tin or iron-copper alloys in specific niche applications.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 111.0 | GPa | — | ||
Shear Modulus(G) | 22.50 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.00750 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | 0.2610 | eV/atom | — |