CuSiTc2

metal

· JVASP-81790· CuSiTc2

CuSiTc2 is a copper-silicon-technetium intermetallic compound representing an experimental metallic phase in the copper-silicon system with technetium addition. This material belongs to the family of lightweight intermetallics and is primarily of research interest rather than established industrial production, with potential applications in advanced aerospace and high-temperature engineering where the combination of low density with metallic bonding characteristics may offer advantages over conventional copper alloys or titanium-based systems.

Experimental intermetallic researchLightweight structural applicationsHigh-temperature metallicsAerospace feasibility studiesMaterials science databaseAdvanced alloy development

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Density(ρ)	697	kg/m³	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions
Band Gap(Eg)	0.000	eV	—
Magnetic Moment(μB)	6.860	µB	—
Seebeck Coefficient(S)	27.53	µV/K	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Energy Above Hull(ΔEhull)	3.521	eV/atom	—
Formation Energy(ΔHf)	3.325	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

CuSiTc2

Physical Properties

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control