CuSiIr2 is a ternary intermetallic compound combining copper, silicon, and iridium elements. This material represents a research-phase composition rather than a commercial alloy, likely investigated for high-temperature structural applications or specialized wear-resistant coatings where the iridium content provides hardness and thermal stability. The combination of copper's thermal conductivity with iridium's refractory properties and silicon's strengthening effects suggests potential use in extreme-environment applications, though practical deployment remains limited due to cost, processability, and limited characterization data compared to established commercial intermetallics.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 1.251 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 2.570 | µB | — | ||
Seebeck Coefficient(S) | 32.38 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 3.210 | eV/atom | — | ||
Formation Energy(ΔHf) | 2.900 | eV/atom | — |