CuSi2N3 is a ternary ceramic compound combining copper, silicon, and nitrogen—a material class that bridges metallic and ceramic properties. This compound is primarily of research and development interest rather than widespread industrial use, belonging to the family of metal silicon nitrides that show potential for high-temperature structural applications and wear-resistant coatings. Engineers would consider this material in specialized contexts where thermal stability, hardness, and the unique properties of copper-doped nitride ceramics offer advantages over conventional alternatives, though material availability and processing maturity remain limiting factors for adoption.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 4.440 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 1.862 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.1126 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.8158 | eV/atom | — |