CuPd is a copper-palladium alloy that combines the electrical and thermal conductivity of copper with the corrosion resistance and catalytic properties of palladium. It is employed in specialized applications requiring both high conductivity and chemical durability, particularly in electronics, catalysis, and corrosion-critical environments where pure copper alone would degrade. This alloy is valued in research and precision manufacturing contexts where the palladium content enhances surface stability and extends service life in demanding chemical or thermal conditions.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 157.4 | GPa | — | ||
Poisson's Ratio(ν) | 0.3800 | - | — | ||
Shear Modulus(G) | 59.28 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 10.30 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg)2 entries | 0.000 | eV | — | ||
| ↳ | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.01760 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.1026 | eV/atom | — |