CuNiSb2 is a copper-nickel-antimony intermetallic compound that combines the corrosion resistance of copper-nickel alloys with the hardening effects of antimony. While not widely documented in mainstream engineering applications, this material belongs to the family of binary and ternary copper-nickel compounds studied for specialized applications requiring enhanced strength, thermal stability, or electromagnetic properties. Its research context suggests potential use in thermoelectric devices, electrical contacts, or wear-resistant coatings where the antimony phase improves hardness and material performance over conventional Cu-Ni alloys.
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| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K)2 entries | 91.92 | GPa | DFT | ||
| ↳ | 90.82 | GPa | DFT · OptB88vdW | ||
Poisson's Ratio(ν) | 0.3200 | - | DFT · OptB88vdW | ||
Shear Modulus(G)2 entries | 37.93 | GPa | DFT | ||
| ↳ | 37.17 | GPa | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 7.997 | kg/m³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg)2 entries | 0.000 | eV | DFT · OptB88vdW | ||
| ↳ | 0.000 | eV | DFT · TBmBJ | ||
Magnetic Moment(μB) | 0.000 | µB | DFT · OptB88vdW | ||
Thermoelectric Power Factor(PF)2 entries | 0.000811 | W/(m·K²) | DFT · OptB88vdW · n-type · 1e20 cm⁻³ · 327°C | ||
| ↳ | 0.000742 | W/(m·K²) | DFT · OptB88vdW · p-type · 1e20 cm⁻³ · 327°C | ||
Seebeck Coefficient(S)2 entries | 10.99 | μV/K | DFT · OptB88vdW · n-type · 1e20 cm⁻³ · 327°C | ||
| ↳ | 10.48 | μV/K | DFT · OptB88vdW · p-type · 1e20 cm⁻³ · 327°C |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.01710 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf) | -0.1203 | eV/atom | DFT · OptB88vdW |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data