Copper cyanide (CuCN) is an inorganic compound combining copper metal with a cyanide ligand, belonging to the family of metal-organic coordination compounds. It finds niche industrial applications in electroplating processes, metal surface treatments, and specialized synthesis routes for copper-based catalysts and semiconductors. Engineers select CuCN primarily for its role in case-hardening and surface enrichment treatments where controlled copper deposition is required, though its toxicity and handling constraints limit adoption compared to alternative copper electroplating salts; it is also of research interest in materials chemistry for producing novel copper-cyanide complexes and nanostructured materials.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 70.90 | GPa | — | ||
Poisson's Ratio(ν) | 0.3000 | - | — | ||
Shear Modulus(G) | 38.56 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 3.012 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 2.633 | eV | — | ||
Dielectric Constant (Relative Permittivity)(εr) | 5.767 | - | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Piezoelectric Modulus(eij) | 0.1996 | C/m² | — | ||
Seebeck Coefficient(S) | -239.2 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.3096 | eV/atom | — | ||
Formation Energy(ΔHf)2 entries | 0.3282 | eV/atom | — | ||
| ↳ | 0.3033 | eV/atom | — |