CuBN3 is a copper-boron nitride composite or intermetallic compound combining metallic copper with boron nitride phases, designed to leverage the thermal conductivity and hardness of boron nitride within a copper matrix. This material is primarily explored in research and specialized industrial contexts where simultaneous thermal management and wear resistance are critical, such as heat dissipation applications, cutting tools, and electronic packaging; it offers potential advantages over pure copper in abrasive or high-temperature wear environments, and over monolithic boron nitride in applications requiring enhanced thermal and electrical conductivity.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.00187 | μB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | 2.060 | eV/atom | — |