CuBN is a copper-boron nitride composite or intermetallic compound that combines the thermal and electrical conductivity of copper with the hardness and thermal stability of boron nitride. This material is primarily investigated for thermal management and high-temperature applications where conventional copper or boron nitride alone cannot meet performance demands, offering potential advantages in demanding aerospace and electronics cooling systems.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 4.021 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 2.490 | eV/atom | — | ||
Formation Energy(ΔHf) | 1.564 | eV/atom | — |