CuB11 is a copper-boron intermetallic compound representing an experimental metal system combining copper's electrical and thermal conductivity with boron's lightweight and hardening characteristics. While not widely commercialized, copper-boron metallics are investigated for advanced aerospace and electronic applications where the combination of reduced density, enhanced hardness, and retained conductivity could offer performance advantages over conventional copper alloys. This material family remains primarily in research and development phases, with potential relevance for engineers exploring next-generation thermal management or structural electronic components.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 3.258 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.3123 | eV/atom | — | ||
Formation Energy(ΔHf) | 0.3123 | eV/atom | — |