CuAg3 is a copper-silver intermetallic compound representing a high-silver-content composition in the Cu-Ag binary system. This material combines copper's thermal and electrical conductivity with silver's superior properties, making it relevant for specialized applications where enhanced performance over pure copper or dilute copper-silver alloys is needed. The precise stoichiometry suggests potential use in electrical contacts, brazing fillers, or research into phase-stable intermetallics, though it is not a common commodity material in mainstream engineering.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 9.875 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Seebeck Coefficient(S) | -7.110 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.07280 | eV/atom | — | ||
Formation Energy(ΔHf) | 0.07280 | eV/atom | — |