Cu4Pd is an intermetallic compound composed of copper and palladium, belonging to the family of noble-metal alloys that combine the cost-efficiency and thermal properties of copper with the corrosion resistance and catalytic characteristics of palladium. This material is primarily of interest in research and specialized industrial contexts where corrosion resistance, catalytic activity, or electrical properties must be balanced against cost—such as in hydrogen storage, catalysis, and electrical contact applications. Cu4Pd represents an important compositional space in the Cu-Pd phase diagram and is typically explored in materials research for its potential in fuel cell components, hydrogen permeation membranes, and advanced coatings where palladium's selectivity and durability can be leveraged without requiring bulk palladium.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K)2 entries | 145.9 | GPa | — | ||
| ↳ | 145.9 | GPa | — | ||
Elastic Compliance Tensor(Sij) | Matrix (redacted) | 1/GPa | — | ||
Elastic Anisotropy(AU) | 1.396 | - | — | ||
Elastic Stiffness Tensor(Cij) | Matrix (redacted) | Pa | — | ||
Poisson's Ratio(ν) | 0.3486 | - | — | ||
Shear Modulus(G)2 entries | 49.14 | GPa | — | ||
| ↳ | 49.14 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — |