Cu3SnP4O16 is a mixed-metal phosphate ceramic compound combining copper, tin, and phosphorus oxides. This material belongs to the family of metal phosphates, which are primarily explored in research contexts for ion-conduction and electrochemical applications. While not yet widely established in mainstream engineering, copper-tin phosphate compounds show promise in battery electrolytes, thermal management systems, and specialized catalytic applications where the combination of metallic cations offers electrochemical stability or enhanced conductivity over single-metal alternatives.
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| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 3.890 | kg/m³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | DFT · OptB88vdW | ||
Magnetic Moment(μB) | 0.000 | µB | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.00750 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf) | -1.664 | eV/atom | DFT · OptB88vdW |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data