Cu3 Pd1

semiconductor

· Cu3 Pd1

Cu3Pd1 is an intermetallic compound combining copper and palladium in a 3:1 atomic ratio, belonging to the family of copper-palladium alloys that exhibit semiconductor or metallic behavior depending on processing and structure. This material is primarily of research interest for catalytic applications, hydrogen storage, and advanced electronic devices, where the combination of copper's conductivity and palladium's catalytic properties offers potential advantages over single-element alternatives. Cu3Pd1 is not yet widely established in high-volume industrial production but represents an emerging candidate in materials science for applications where palladium's cost can be offset by improved performance in hydrogen-related or catalytic processes.

hydrogen storage and absorptioncatalytic surfacespalladium alloy researchadvanced electronic devicesexperimental intermetallic compounds

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.00590	eV	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Formation Energy(ΔHf)	-0.1010	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

Cu3 Pd1

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control