Cu2PdAu is a ternary intermetallic compound composed of copper, palladium, and gold. This material belongs to the family of precious-metal intermetallics and is primarily studied in research contexts for its potential in high-performance applications requiring corrosion resistance, catalytic activity, or specialized electrical properties. The combination of noble metals (Pd and Au) with copper creates a phase with enhanced stability and selective properties compared to binary copper-palladium or copper-gold alloys, making it of interest in catalysis, electronics, and materials science research rather than as a commodity engineering material.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 12.53 | kg/m³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg)2 entries | 0.000 | eV | DFT · OptB88vdW | ||
| ↳ | 0.000 | eV | DFT · TBmBJ | ||
Magnetic Moment(μB) | 0.000 | µB | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf) | -0.1174 | eV/atom | DFT · OptB88vdW |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data