Cu1Pt7 is an intermetallic compound composed of copper and platinum in a 1:7 atomic ratio, belonging to the class of noble metal intermetallics. This material is primarily of research and experimental interest rather than established industrial production, studied for its potential in high-temperature applications, catalysis, and electronic devices where the combination of platinum's stability and copper's cost moderation could offer advantages. The compound represents a niche area within materials science focused on understanding phase diagrams and properties of Cu-Pt systems, with potential relevance to aerospace, chemical processing, and microelectronics industries if viable manufacturing routes can be developed.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.00210 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.07200 | eV/atom | — |