Cu1Pd1 is an intermetallic compound composed of equal atomic portions of copper and palladium, belonging to the semiconductor class of materials. This compound exhibits characteristics intermediate between metallic and semiconducting behavior, making it of particular interest in research contexts for electronic and catalytic applications where the Cu-Pd system offers tunable electrical and chemical properties.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 157.4 | GPa | — | ||
Shear Modulus(G) | 59.28 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.01990 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.1200 | eV/atom | — |