Cu1Au3 is an intermetallic compound composed of copper and gold in a 1:3 atomic ratio, classified as a semiconductor material. This compound belongs to the family of noble metal intermetallics and is primarily of research interest for studying electronic, optical, and catalytic properties in gold-copper systems. The material is not widely deployed in volume production, but represents an important composition point in the Cu-Au phase diagram for investigating how stoichiometric control affects bandgap, carrier mobility, and surface reactivity in precious-metal alloy systems.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 145.8 | GPa | — | ||
Shear Modulus(G) | 24.14 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.00370 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.01900 | eV/atom | — |