Cu0.375Mn0.25Ni0.125Sn0.25 is a quaternary copper-based alloy combining copper, manganese, nickel, and tin in specific proportions, likely developed for enhanced mechanical and corrosion resistance properties compared to binary or ternary copper alloys. This composition falls within research-driven materials development, potentially targeting applications requiring improved strength, wear resistance, or specific electromagnetic properties while maintaining copper's excellent thermal and electrical conductivity. The inclusion of manganese and nickel suggests refinement of grain structure and corrosion performance, while tin may contribute to hardening and fatigue resistance.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.2747 | eV/atom | Measured |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data