BiPb3Au

metal
· JVASP-145326· BiPb3Au

BiPb3Au is a bismuth-lead-gold intermetallic compound belonging to the heavy metal alloy family. This material is primarily of research and specialized metallurgical interest rather than mainstream industrial production, with applications centered on low-melting-point systems, thermal management devices, and potential use in lead-free solder formulations where bismuth and gold additions provide improved wetting and mechanical properties. Engineers considering this alloy should evaluate it in contexts requiring high density, controlled melting behavior, or where bismuth-gold interactions offer advantages over conventional tin-based or indium-based alternatives in niche electronics or joining applications.

experimental intermetallic compoundslow-melting solder developmentthermal interface materialshigh-density alloy researchspecialized joining applicationselectronics packaging (research-phase)

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65
PropertyValueUnitConditionsSource
Density(ρ)
kg/m³
Verified Unverified Low confidence (<80%) Link to source
PropertyValueUnitConditionsSource
Band Gap(Eg)
eV
Magnetic Moment(μB)
µB
Verified Unverified Low confidence (<80%) Link to source
PropertyValueUnitConditionsSource
Energy Above Hull(ΔEhull)
eV/atom
Formation Energy(ΔHf)
eV/atom
Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.