Be1Cu1 is an intermetallic compound combining beryllium and copper, classified as a semiconductor material with potential applications in electronic and thermal management systems. This compound represents an experimental or specialized composition within the beryllium-copper family, which is known for combining high thermal and electrical conductivity with moderate strength. Engineers would consider this material primarily for niche applications where the unique properties of beryllium-copper intermetallics offer advantages over conventional copper alloys or pure semiconductors, though its use is limited by beryllium's toxicity concerns and the material's relative scarcity in industrial applications.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 142.5 | GPa | — | ||
Shear Modulus(G) | 83.30 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.02970 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.08500 | eV/atom | — |