AgSnAu is a ternary precious metal alloy combining silver, tin, and gold. This composition is primarily used in electronic interconnections and brazing applications where corrosion resistance, electrical conductivity, and reliable joint formation are critical. The alloy is notable in microelectronics and jewelry manufacturing for delivering the strength and workability of tin-bearing solders while leveraging gold and silver's superior conductivity and oxidation resistance compared to lead-free alternatives.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 10.20 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.05797 | eV/atom | — |