AgSN is a silver-tin intermetallic compound representing a phase in the Ag-Sn binary system, traditionally encountered in solder metallurgy and electronic interconnection applications. This material is primarily relevant in lead-free solder formulations and electronic packaging, where silver-tin phases contribute to joint strength and reliability. AgSN is notable as a research-grade material for understanding phase behavior in solder systems and for thermal cycling resistance in electronics, though it is not typically specified as a standalone engineering material in structural applications.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | -3.310 | GPa | — | ||
Poisson's Ratio(ν) | 0.01000 | - | — | ||
Shear Modulus(G) | -2.830 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 1.331 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.5210 | eV | — | ||
Magnetic Moment(μB) | 1.996 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 2.401 | eV/atom | — | ||
Formation Energy(ΔHf) | 2.355 | eV/atom | — |